Plasma 901e Tegal Etcher With Manual
-SOLD AS SEEN IN PICTURES!
- Not tested.
*Cassette to Cassette Poly/Nitride Plasma Etcher
*Easy to use menu driven control
*Input gases controlled by MFC, up to 4 MFC with system
*Non-friction spatula wafer transport
- Power requirement: 208 VAC 25A 1PH
- S/N: CU50134
- Item # CU9000-50134
-Volt: 200/208 VAC
- Curr.: 30 Amps
- Freq.: 50/60 Hz
- Wires: 2+ ground
- Wfg: 11/1999
- meter reads: 5081
-RCTN Chamber item No. CC1106-01302
The system shown in your pictures is sized for 3" wafers. The super spats are narrow at the front so that they can fit into a 3" cassette and the four little stainless steel locating pins on the cassette platforms are at their innermost positions for locating a 3" cassette. You can see that there are three more sets of positions for those pins to accommodate 4", 5" & 6" wafer cassettes.
Specifics Below are taken from the internet. It is up to you to know if they are correct:
Cassette To Cassette In-line Single Wafer Plasma Etcher.Capability to etch vias and contacts with anisotropic or sloped profiles.For etching silicon dioxide, silicon nitrides, and polyimides.Can handle wafers from up to 6 in. Microprocessor control.208 V, 50/60 Hz. Tegal 901e series Plasma/RIE etch System are used by the Semiconductor Industry for integrated circuit fabrication. The system are used in one part of the sequence of manufacturing steps that transfer a pattern formed from a layer of photosensitive material, the photoresist, to a layer that makes up a permanent part of the final device. The process of defining a pattern with photoresist known as photolithography, while the etch process transfers the photoresist pattern to the permanent layer.Tegal 900 Series systems deliver highly reliable, repeatable results in etching a variety of films used to manufacture semiconductor, telecommunications and optoelectronics devices, flat panel displays and thin film magnetic heads.Tegal 901e,are designed around a production-proven wafer transport design that can accommodate 75 mm to 150 mm round silicon, GaAs, InP, and dielectric material substrates. The transport can also be configured to accommodate rectangular substrates up to 125 mm on a side.
Typical Applications for Tegal 901e:1. Nitride etch, 2. Photoresist Descum, 3. Polyimide and BCB etches, 4. Zero Layer Etch, 5. Backside Etch, 6. Isotropic Oxide Etch,7. Non-critical Polysilicon Etch8. Titanium/Tantalum Alloy Etch.
Additional Prep Fees May Apply
