NOTE: It does not include the vacuum pump. It does not include an RF Generator either.
Gas plasma treatment provides a fast, efficient method for surface treatment and cleaning prior to wire bonding, die attach, encapsulation, conformal coating and other processes. Plasma processing enhances lamination bond strength, improves wire bond strength and uniformity, promotes underfill adhesion and enhances die attach.
The PX-Series control module monitors and controls the vacuum and gas flow, chamber pressure, and power level. Up to four mass controllers are connected to a gas-mixing manifold to provide process recipe flexibility. The microprocessor provides automatic operation, is user
friendly, and ensures precise, reproducible process conditions. Cycle duration is controlled by elapsed time and can be downloaded to a PC for further analysis.
An emergency shut-off button, located on the front panel, immediately terminates the gas flow and RF power. Safety interlocks prevent activation of RF power when the chamber door is open. Safe viewing is ensured with a separate, full length glass door that shields operators from plasma generated UV energy.
Additional Prep Fees May Apply.
