Harrick Plasma High Power Expanded Plasma Cleaner model: PDC-001
**Plasma Cleaner system has been tested to specifications. has minimal cosmetic blemishes from normal use. Everything in pictures is included. See photos for further details.
Harrick Plasma Expanded Plasma Cleaner. The PDC-001 Expanded Plasma Cleaner is our larger benchtop plasma cleaner, extensively used for nanoscale surface cleaning and surface chemistry modification. Maximum RF power of 30W; Adjustable RF power settings (LOW, MEDIUM, HIGH); 6in. diameter x 6.5in. length Pyrex chamber; Hinged door with viewing window; Active fan cooling; Integral switch for a vacuum pump; Metering valve to qualitatively control gas flow and chamber pressure; Three-way valve to quickly switch from introducing gas, venting and isolating the chamber; Size: 11in. H x 18in. W x 9in. D; Weight: 37 lb.
REQUIRED: A separate vacuum pump (minimum pump speed 23 L/min, ultimate total pressure of 200 mTorr or less) is required to run the plasma process.
Harrick Plasma Plasma Cleaners High Power Expanded Plasma Cleaner with twice the cleaning rate as the Expanded Plasma Cleaner, the High Power Expanded Plasma Cleaner is a versatile instrument, suitable for etching organic thin films (10-100 nm) as well as surface cleaning and modification.
FEATURES
Larger, benchtop unit
Adjustable RF power settings (Low, Medium, High)
Maximum RF power of 45W
Low RF power setting is equivalent to High RF power setting on PDC-001/PDC-002
Includes a 6 diameter x 6.5 length Pyrex chamber
Hinged door with viewing window
Active fan cooling
Integral switch for a vacuum pump
1/8 NPT metering valve to qualitatively control gas flow and vacuum pressure
1/8 NPT 3-way valve to quickly switch from bleeding in gas, isolating the chamber, and venting
Optional Plasma Flogas mixer allows quantitative control of up to two (2) process gases and monitoring of chamber pressure
Optional quartz chamber and sample tray Compatible
Our Plasma Cleaners require a vacuum pump with a minimum pump speed of 1.4 m3/hr (23 L/min) and ultimate total pressure of 200 mTorr (0.27 mbar) or less for pumping nonreactive gases (air, N2, Ar), see our Standard Vacuum Pumps. Pumping concentrated or pure oxygen gas, see our Oxygen Service Pumps.
ADVANTAGES OF PLASMA: Plasma can be used to control surface properties through nanoscale cleaning and modifying surface chemistry without altering bulk material properties. The plasma is at near-ambient temperature, minimizing the risk of damage to heat-sensitive materials.
VERSATILITY OF PLASMA: Plasma treatment may be applied to a variety of materials as well as complex surface geometries, including glass and silicon substrates, polymer fibers and fibrous scaffolds, metal films, and porous membranes.
VALIDATED EXPERIENCE: Our plasma products have been cited in over 4,000 peer-reviewed technical articles and over 200 patents in a broad range of research areas.
QUARTZ CHAMBERS PDC-00Q | PDC-32Q
Recommended for use with reactive and fluorinated gas (e.g. CF4 ) and for applications sensitive to trace impurities in Pyrex
PLASMAFLOPDC-FMG/FMG-2
More precise, quantitative control of gas flowrate and monitoring of vacuum pressure to ensure process consistency
Two gas inputs into flowmeters for gas mixing or independent control of two gases
Add a second gas source without needing to manually swap gas lines
Digital meter displays pressure range of 1 mTorr to 760 Torr
VACUUM GAUGE & DIGITAL METERPDC-VCG/VCG-2
Vacuum gauge and digital meter as a stand-alone accessory
Digital meter displays pressure range of 1 mTorr to 760 Torr
Monitoring vacuum pressure is beneficial for process repeatability and consistency
Additional Prep Fees May Apply
